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KAUST researchers integrate two-dimensional materials into silicon microchips

KAUST · Jun 13

KAUST researchers have integrated a hexagonal boron nitride sheet into CMOS microchips, creating a hybrid 2D-CMOS microchip. This integration leverages the electrical and thermal properties of 2D materials, resulting in circuits that are smaller, more energy-efficient, and have longer lifespans. The KAUST Imaging and Characterization Core Lab contributed to the observations in this study, which involved researchers from six countries. Why it matters: This achievement represents a significant advancement in microchip miniaturization and performance, potentially impacting various electronic applications.

2D materials spur new electronic devices, circuits

KAUST · Dec 6

KAUST researchers collaborated with TSMC to review the potential of 2D materials in overcoming silicon limitations for microchips. They find that while 2D materials show promise, performance degrades when using scalable fabrication techniques like chemical vapor deposition. 2D materials have been integrated into some commercial products like sensors, but high-integration-density circuits are still a challenge. Why it matters: This research highlights the ongoing efforts and remaining hurdles in utilizing novel materials to advance semiconductor technology in line with industry roadmaps.