2D materials spur new electronic devices, circuits

Summary

KAUST researchers collaborated with TSMC to review the potential of 2D materials in overcoming silicon limitations for microchips. They find that while 2D materials show promise, performance degrades when using scalable fabrication techniques like chemical vapor deposition. 2D materials have been integrated into some commercial products like sensors, but high-integration-density circuits are still a challenge. Why it matters: This research highlights the ongoing efforts and remaining hurdles in utilizing novel materials to advance semiconductor technology in line with industry roadmaps.