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KAUST researchers integrate two-dimensional materials into silicon microchips

KAUST · Jun 13

KAUST researchers have integrated a hexagonal boron nitride sheet into CMOS microchips, creating a hybrid 2D-CMOS microchip. This integration leverages the electrical and thermal properties of 2D materials, resulting in circuits that are smaller, more energy-efficient, and have longer lifespans. The KAUST Imaging and Characterization Core Lab contributed to the observations in this study, which involved researchers from six countries. Why it matters: This achievement represents a significant advancement in microchip miniaturization and performance, potentially impacting various electronic applications.

Computing in the Post-Moore Era

MBZUAI · Invalid Date

A professor from EPFL (Lausanne) gave a talk at MBZUAI on computing in the post-Moore era, highlighting the slowing of Moore's Law due to physical limits in transistor miniaturization. He discussed research challenges and opportunities for future computing technologies. He presented examples of post-Moore technologies he helped develop in the datacenter space. Why it matters: As Moore's Law slows, research into alternative computing paradigms becomes critical for the continued advancement of AI and digital services in the UAE and globally.